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Ordering number : EN*5783
LC9997M
1/5-Inch Frame Transfer CCD NTSC Color Image Sensor
Preliminary Overview
The LC9997M is a 1/5-inch optical size frame transfer CCD solid-state image sensor.
Package Dimensions
unit: mm 3217
[LC9997M]
Features
* Effective pixels [total pixels]: 508 x 246 [532 x 250] (H x V) * Number of optical black pixels: Horizontal: 2 in front, 22 in back Vertical: 2.5 above, 1.5 below * Dummy bits: Horizontal: 4 pixels * Horizontal resolution: 330 TV lines * Small form factor supports compact application products * 20-pin half-pitch transparent DIP package * Horizontal shift register operates at 5 V. * Supports variable-speed electronic shutter operation.
Device Structure
* * * * * * 1/5-inch optical size frame transfer CCD image sensor Unit cell size: 5.8 m x 9.0 m (H x V) Chip size: 4.18 mm x 5.10 mm (H x V) Parallel gate CCD sensor Built-in high-sensitivity output amplifier Cy-G-Ye-W mosaic complementary color filters
Specifications
Absolute Maximum Ratings at Ta = 25C
Parameter Supply voltage Load gate voltage N substrate - p-well voltage N substrate - image and storage area voltage Symbol VDD VGG VPW = 0 V VPW = 0 V NSUB-VPW NSUB- 1 to 4, S1 to S4 Horizontal clock pin, R: VPW = 0 V Pin voltage Other clock pins: VPW = 0 V Other pins: VPW = 0 V Operating temperature Storage temperature Topr Tstg Conditions Ratings -0.3 to +18 -0.3 to +5 -0.3 to +50 -0.3 to +55 -0.3 to +18 -15 to +18 -0.3 to +10 -10 to +60 -30 to +80 Unit V V V V V V V C C
SANYO Electric Co.,Ltd. Semiconductor Bussiness Headquarters
TOKYO OFFICE Tokyo Bldg., 1-10, 1 Chome, Ueno, Taito-ku, TOKYO, 110-8534 JAPAN
53098RM (OT) No. 5783-1/11
LC9997M Block Diagram
Optical black area
1.5 pixels
Imaging area
22 pixels
2 pixels
2.5 pixels
Storage area
Output block
Horizontal shift register (CCD)
4 dummy bits
No. 5783-2/11
LC9997M Pixel Arrangement
1.5 pixels
Imaging area
2.5 pixels
2 pixels
22 pixels
Storage area
Output amplifier
Horizontal shift register
No. 5783-3/11
LC9997M Pin Assignment
Pin Functions
Pin No. 1 2 3 4 5 6 7 8 9 10 Symbol NSUB WPW 4 3 2 1 R VDD VOUT NSUB Reset gate Supply voltage CCD output N substrate Imaging area clock N substrate P-well Function Pin No. 20 19 18 17 16 15 14 13 12 11 Symbol NSUB S4 S1 S2 S3 H1 H2 VOG VGG NSUB Horizontal block clocks CCD output gate Load gate N substrate Storage area clocks N substrate Function
No. 5783-4/11
LC9997M Clock Voltage Conditions at a frame shift frequency of 3.58 MHz
Parameter Imaging area pulse signals: o1, o2, o3, o4 Pulse amplitude Low level Storage area pulse signals: oS1, oS2 Pulse amplitude Low level Storage area pulse signals: oS3, oS4 Pulse amplitude Low level Horizontal transfer pulse signals: oH1, oH2 Pulse amplitude Low level Reset gate: oR Pulse amplitude Low level Substrate pulse: oNSUB Pulse amplitude Low level VHSUB VLSUB *2. See Figure 1. See Figure 1. 30.0 17.5 18.0 40.0 18.5 V V VPR VLR 4.5 4.2 5.0 4.5 5.5 4.8 V V VPH VLH 4.5 0 5.0 0 5.5 0.5 V V VPSL VLSL 14.0 -9.0 14.5 -8.5 15.0 -8.0 V V VPSL VLSL 14.0 -8.0 14.5 -7.5 15.0 -7.0 V V VPIF VLIF *1 *1 14.0 -10.0 14.5 -9.5 15.0 -9.0 V V Symbol Conditions Ratings min typ max Unit
Notes: 1. Insert 47-pF capacitance as shown in Figure 2. 2. VHSUB must be adjusted so that the saturated output is maximum within the range where image degradation does not occur. Shutter pulse Slice pulse
Charge sweep-out pulse
Frame shift
Imaging area pulses
One field
Figure 1
Vertical driver IC LC89901V
Core IC LC99053
Figure 2 Bias Conditions
Parameter P - well Output circuit voltage OG bias Symbol VPW VDD VGG VOG *3 *4 *4 14.5 1.2 4.5 Conditions Ratings min typ 0 15.0 1.5 5.0 15.5 1.8 5.5 max Unit V V V V
No. 5783-5/11
LC9997M
Notes: 3. This voltage must not exceed the substrate pulse low level VLSUB. 4. These input pins are high-impedance inputs.
DC Characteristics
Parameter DC operating current Symbol IDD Conditions Ratings min 4.5 typ 7.0 max 11.0 Unit mA
Drive Pulse Waveform Stipulations
VP: Pulse amplitude VL: Low level
Pulse Waveform Figure
Symbol tWH typ 166 141 166 141 141 141 141 141 1.36 1.36 62.1 62.1 11 50 50 9.9 4.2 tWL typ 100 116 100 116 116 116 116 116 62.1 62.1 1.36 1.36 86 49 49 16.59* 16.59* tr typ 6.5 11 6.5 11 11 11 11 11 30 30 30 30 4 3 3 0.07 0.07 tf typ 6.5 11 6.5 11 11 11 11 11 30 30 30 30 4 3 3 1 1 s s ns Reset pulse Horizontal transfer time Slice pulse Shutter pulse ns Vertical transfer time for a single horizontal line Values in the box enclosed in the darker lines are in microseconds. ns Frame transfer time When the frame shift frequency is 3.58 MHz ns Frame transfer time When the frame shift frequency is 3.58 MHz Unit Notes
1 2 3 4 S1 S2 S3 S4 S1 S2 S3 S4 R H1 H2 NSUB NSUB
Note: The item marked with an asterisk (*) is in milliseconds.
Imaging Characteristics (storage time = 1/60 s) at Ta = 25C
Parameter [Sensitivity] Luminance signal R gain B gain Image signal uninformity Saturation signal Smear Dark signal Color irregularity (mura) Gamma characteristics S GR GB VF Vsat SM Vdrk Vcs Test method 1 Test method 1 Test method 1 Test method 2 Test method 3, *5 Test method 4, *6 Test method 5. Ta = 55C Test method 6 1 600 0.04 7 50 0.7 2.0 130 2.4 4.4 15 % mV % mV mV mV Symbol Conditions Ratings min typ max Unit
Notes: 5. When the substrate pulse VHSUB is used fixed at 402 V, the minimum saturation output is 450 mV. 6. When the frame shift frequency is 3.58 MHz and the storage time is 1/60 s.
No. 5783-6/11
LC9997M Test Methods The following tests are to be performed using the evaluation unit made by Sanyo Electric Co., Ltd. 1. Sensitivity Using the CCD-SY1 light source (made by Wakasa Optical Co., Ltd.) illuminate the pixel surface with an intensity of 7 lux. Measure the CCD outputs (G, Ye, Cy, and W) at the center of the screen in that state with the T8331 tester (made by Advantest, Inc.). The sensitivity is the average value for four pixels. Use the following formulas to determined the R and G gains. R=E-D B=A-C G = (C+D)/2 GR = G/R GB = G/B
2.Image signal uniformity Measure the uniformity under the following conditions * The standard drive state (See the specifications document.) * Using a halogen lamp with a color temperature of 3200 K as the light source * Using an IR cutting filter (C-500, 1mmt) Illuminate the CCD surface with an intensity of 7 lux. Divide the surface of the CCD into 45 sections as shown in the figure and measure the average value for each block. Determine the maximum, minimum, and mean of those measurements, and determine the ratio of the difference with respect to the block average. - VF = ------------------------------------------------------------
3. Saturation signal Set up the following conditions using the Sanyo evaluation unit. * The standard drive state (See the specifications document.) * Light source: The LV-2001 pattern box (made by Kyoritsu Electronics, intensity: 870 NITS, color temperature: 3100 K) * Lens: HF 16A (made by Fujinon) with the aperture fully open. Measure the CCD output signal from the center of the screen under these conditions. 4. Smear * Place the 1/10-V chart described below in front of the halogen light source and image it. * Using neutral density filters, adjust the incident illumination such that the CCD output signal at point A becomes 250 mV. * Remove the neutral density filters and measure the value of the CCD output signal for the first line (i.e. at point B).
No. 5783-7/11
LC9997M
Point B
VB * TND SM = ---------- x 100 [%] 250
Point A
VB: The amount of smear at point B (mV) TND: The transmittance of the neutral density filters used.
5. Dark signal Block all light from the surface of the CCD element, and measure the CCD output signal at the center of the screen. For this measurement, do not measure the difference between the signal level and the optical black area level, but rather, read out the difference with the no-signal level at a point where there is no pixel information. (See the figure.) Structure of the Horizontal Period
Effective pixel area
Optical black area
Optical black area
No-signal area
6. Color irregularity (mura) With no pattern in the LV-2001 pattern box, image the pattern box with a C-500 1-mm thick IR cut filter and a 7% neutral density filter over the whole surface of the 1/5-inch standard lens used for measurement. Verify that the CCD average output at this time is over 200 mV. Calculate the color difference signals RY and BY from the following formula from the average output of post-image processing R, G, and B signals. The color irregularity (mura) CS is defined as the distance between the two points for which the data (RY and BY) is separated the most for all the areas. RY = {(red-green) - (blue-green) x 0.25} x 101/64 BY = {(blue-green) - (red-green) x 0.125} x 50/64 CS = {(RY1-RY2)2 + (BY1-BY2)2}1/2
In each block: V direction: 30 pixels H direction: 60 pixels
Color Irregularity (mura) Data Acquisition Areas
Divided into 8 areas of equal separation.
In each block: V direction: 30 pixels H direction: 60 pixels
Divided into 8 areas of equal separation.
No. 5783-8/11
LC9997M Image Defect Standards
Test temperature 55C Test item White defects At most 5 per zone No white defects that cover 2 or more pixels in the horizontal direction or 2 or more lines in the vertical direction. At most 10 per zone No black defects that cover 2 or more pixels in the horizontal direction or 2 or more lines in the vertical direction. No defects Allowable defects Notes 1
25C
Black defects Molding debris
2 3
Test Conditions Defect position are classified on the monitor as shown below.
is not tested.
Notes 1. A white defect is a 10 mV or more higher than the CCD output optical black area for a black image. The CCD device is defective if any such level is 20 mV or more above the optical black level. 2. A black defect is a level that is 10% or more below the average level when the CCD is illuminated so that the average level is about 400 mV. 3. Using the Fujinon TV zoom lens H6 x 12.5R 1:1.2/12.5-75 stopped down to f 5.6 and with a 20% neutral density filter mounted, no dusts in the resin should be visible on the image screen.
No. 5783-9/11
LC9997M Notes on Handling 1. ESD prevention This CCD image sensor is easily damaged by ESD (electrostatic discharge). The following ESD prevention measures must be taken when handling this device. * All personnel and all equipment must be grounded when handling this CCD device. For safety, personnel should be grounded through a resistor of about 1 M. (We recommend using wrist straps.) * This device should be handled with either bare hands or hands wearing antistatic gloves. Personnel should wear antistatic clothing. Conductive shoes must be worn. * Spread conductive mats on floors and benches in the work areas to prevent static charges from accumulating. * We recommend using ionized air blowers to minimize static charges in areas where CCD sensors are handled. * Antistatic boxes must be used for transporting substrate mounting materials. * Packing materials, boxes, and other items made from plastics, such as styrofoam, that easily accumulate static charges must not be placed on tables where CCD sensors are handled or in the vicinity of CCD handling operations. * Tools, including testers, conveyors, and soldering irons, used in operations on CCD sensors must be grounded. Furthermore, the quality of that grounding must be tested periodically. * Do not handle this IC in the vicinity of TV monitors or other devices that generate high static charges. If unavoidable, apply antistatic measures, such as covering the TV monitor screen with an antistatic filter. * Since static charges accumulate more easily at a low relative humidity, the work environment must be maintained at a relative humidity of 50% or higher. 2. Soldering * The package temperature must not exceed 80C. * In addition to ESD, CCD sensors are easily damaged by thermal stress. When mounting on a printed circuit board, the soldering iron temperature must never exceed 300C, and the soldering time for each pin should be about 2 seconds. * Only use soldering irons that include a temperature controller that holds the soldering tip at a fixed temperature. * Be especially careful to avoid heating the device to over 80C when repairing solder joints by hand and when removing CCDs sensors from printed circuit boards. 3. Debris and contamination * Handle CCD sensors in a clean location only. * Do not touch the package surface with bare hands. Also, do not allow the package surface to come in contact with any objects. If any foreign matter gets onto the package surface, remove it with an air blower. (We recommend using an ionized air blower if possible.) * Remove oil or grease contamination from the CCD package surface with a cotton swab dipped in ethyl alcohol. Be careful not to damage the package surface. * To prevent foreign matter and contamination from occurring, use dedicated cases to hold the CCD sensors, and also equalize temperatures gradually when moving CCD sensors between rooms with radical temperature differences to prevent condensation. 4. Storage * Do not leave CCDs exposed to strong light, such as direct sunlight, for extended periods. * Since high temperatures and high humidity can degrade device characteristics, avoid storing or using these devices in such environments. The temperature and humidity of locations used to store samples must always be within normal ranges (5 to 35C and 45 to 75% RH). * Since CCD sensors are precision optical instruments, be extremely careful not to apply mechanical shocks to these devices. * Avoid locations with corrosive atmospheres or high dust levels. * Avoid locations subject to rapid temperature changes. * Do not stack heavy objects on top of containers holding CCD sensors during storage. * Containers used to hold sample must be made from materials with good antistatic properties. * Be extremely careful not to apply mechanical shocks to these devices, since that could lead to bent pins and reduced reliability during mounting.
No. 5783-10/11
LC9997M 5. Notes on mounting * Use of lenses with optical sizes in excess of 1/5 inch can lead to flare. Consult your Sanyo representative when selecting lenses for use with this product. * This product is mounted in a completely transparent plastic package, and thus is easily affected by light transmitted from the back through the printed circuit board on which the device is mounted. Accordingly, applications must provide adequate light shielding. 6. Transport * Do not throw or drop packages containing CCD sensors. * Protect CCD sensors from moisture when transporting during rain or snow. * Minimize mechanical vibration and shock as much as possible when transporting CCD sensors.
s No products described or contained herein are intended for use in surgical implants, life-support systems, aerospace equipment, nuclear power control systems, vehicles, disaster/crime-prevention equipment and the like, the failure of which may directly or indirectly cause injury, death or property loss. s Anyone purchasing any products described or contained herein for an above-mentioned use shall: Accept full responsibility and indemnify and defend SANYO ELECTRIC CO., LTD., its affiliates, subsidiaries and distributors and all their officers and employees, jointly and severally, against any and all claims and litigation and all damages, cost and expenses associated with such use: Not impose any responsibility for any fault or negligence which may be cited in any such claim or litigation on SANYO ELECTRIC CO., LTD., its affiliates, subsidiaries and distributors or any of their officers and employees jointly or severally. s Information (including circuit diagrams and circuit parameters) herein is for example only; it is not guaranteed for volume production. SANYO believes information herein is accurate and reliable, but no guarantees are made or implied regarding its use or any infringements of intellectual property rights or other rights of third parties. This catalog provides information as of May, 1998. Specifications and information herein are subject to change without notice. PS No. 5783-11/11

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